Electronic structure for increasing combination force between internal electrode and external electrode, and electronic packaging component

Abstract

The invention provides an electronic structure for increasing combination force between an internal electrode and an external electrode, and an electronic packaging component. The electronic structure comprises a substrate body, the electronic packaging component and an electric conduction unit. The electronic packaging component is arranged on the substrate body and comprises a first internal electrode part, a second internal electrode part, a first external electrode part electrically making contact with the first internal electrode part, and a second external electrode part electrically making contact with the second internal electrode part. The electric conduction unit comprises a first electric conduction body which is arranged on the substrate body and electrically makes contact with the first external electrode part, and a second electric conduction body which is arranged on the substrate body and electrically makes contact with the second external electrode part. The electronic packaging component is provided with a first groove and a second groove. The first external electrode part extends into the first groove to make contact with the first top end connecting face of the first internal electrode part, and the second external electrode part extends into the second groove to make contact with the second top end connecting face of the second internal electrode part.