Protruding electrode for connecting electronic component, electronic component mounted body using such electrode and methods for manufacturing such electrode and electronic component mounted body

Abstract

A method of forming an electrode terminal protruding electrode (120) (110) on the electronic component (100), the bump electrode (120) consists of: using a transfer mold having a terminal electrode portion is formed in the recess electronic component (100) (110) above the first conductor (130), and a laminated body is formed in a second conductive (140) (130) constituting the first conductor. According to this configuration, the protrusion may be formed of a fine pitch electrode having an arbitrary shape (120).