Electrode pad for mounting electronic component and mounting structure of electronic component

Abstract

The present invention relates to an electrode pad for mounting electronic components, an aspect of the invention is a circuit in the electronic component to the electrode pad for mounting on a surface of a substrate, and first and second electrode portions and facing each other facing each other, the first and the second being arranged separately from the electrode portion and the predetermined distance, the second comprises first and second, a third and a fourth electrode arranged so as to form the corners of the electrode pad with the electrode unit parts of the first to At least one of the fourth electrode portion is provided with a chamfer the edges forming the corner of the cutting is formed, the chamfered surface is formed on the surface portion facing the first to fourth least two adjacent electrodes to each other of the electrode portions, the chamfered surface facing each other, there is provided an electrode pad for electronic component mounting, characterized in that parallel to each other. When using the electronic products for mounting the electrode pad in accordance with the present invention, it is possible to sufficiently increase the width of the external electrode of the electronic component that is easy to control the size, shape, etc. of the external electrode. An electrode pad, a chamfer, multi-layer chip capacitor, MLCC, ESL