Network Properties and Latency of Triple-based Hierarchical Interconnection Netrwork
The compare results show that THIN is a better candidate for constructing the NOC than 2-D Mesh, when there are not too many nodes.
Abstract
A new chip design paradigm called Network-on-Chip (NOC) offers a promising architectural choice for future SOC (System-on-Chip). Triple-based Hierarchical Interconnection Network (THIN) was proposed that aims to decrease the node degree, reduce the links and shorten the diameter. The topology of THIN is very simple and it has obviously hierarchical, symmetric and scalable characteristic. In this paper, the network properties and zero-load latency are studied and compared with 2-D mesh. The compare results show that THIN is a better candidate for constructing the NOC than 2-D Mesh, when there are not too many nodes.