This session discusses development of Three Dimensional Integration Technologies in Japan, European Approaches to Application-Specific Integrated Circuits, and prospects for High Speed Bipolar LSI Technology - Digital LSI Applications.
Keynote Speakers. Development of Three Dimensional Integration Technologies in Japan (S. Furukawa). European Approaches to Application-Specific Integrated Circuits (J. Borel). System Demands vs. Opportunities (W.R. Heller). High-Level Synthesis Systems. Invited Paper: The Role of HDLS in the Digital Design Process (T.L. Thorp). Plus 3 contributed papers. Specification and Verification. Invited Paper: Algorithms and Specifications (G. Birtwistle). Plus 3 contributed papers. Placement and Routing (3 papers). Placement Refinement (2 papers). High-Performance Technologies. Invited Papers: High-Performance Bipolar VLSI - The Only Way (G. Wilson). Prospects for High Speed Bipolar LSI Technology - Digital LSI Applications (S. Horiguchi, M. Ino, M. Suzuki). GaAs Digital IC's for Computer Applications (M. Rocchi). CMOS Technology for High Speed VLSI (T. Iizuka). Low Temperature MOS Microelectronics (F. Gaensslen). Machine Architectures. Invited Paper: Inference Machines in FGCS Project (S. Uchida). Plus 2 contributed papers. High-Speed Systems (3 papers). Timing Verification and Electrical Simulation (3 papers). Layout Synthesis (3 papers). Author Index.