Electronics Manufacturing
This chapter discusses Mechanisms Underlying the Unstable Contact Resistance of ECAs, and the implementation of Lead-Free Soldering.
Abstract
Table of contents Chapter 1: Introduction to Environmentally Benign Electronics Manufacturing Chapter 2: Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps Chapter 3: WLCSP with Lead-Free Solder Bumps on PCB/Substrate Chapter 4: Chip (Wafer)-Level Interconnects with Solderless Bumps Chapter 5: WLCSP with Solderless Bumps on PCB/Substrate Chapter 6: Environmentally Benign Molding Compounds for IC Packages Chapter 7: Environmentally Benign Die Attach Films for IC Packaging Chapter 8: Environmental Issues for Conventional PCBs Chapter 9: Halogenated and Halogen-Free Materials for Flame Retardation Chapter 10: Fabrication of Environmentally Friendly PCB Chapter 11: Global Status of Lead-Free Soldering Chapter 12: Development of Lead-Free Solder Alloys Chapter 13: Prevailing Lead-Free Alloys Chapter 14: Lead-Free Surface Finishes Chapter 15: Implementation of Lead-Free Soldering Chapter 16: Challenges for Lead-Free Soldering Chapter 17: Introduction to Conductive Adhesives Chapter 18: Conductivity Establishment of Conductive Adhesives Chapter 19: Mechanisms Underlying the Unstable Contact Resistance of ECAs Chapter 20: Stabilization of Contact Resistance of Conductive Adhesives Index About the Author